L3Harris process engineers working at government-funded state-of the-art cleanroom facilities provide the unique ability for inexpensive fully in-house rapidly developed solutions from chip-level die design to wafer-level packaging. Turnaround time as quick as one week compared to foundry often requiring six months or more at three times the cost.
The MPD group works with other scientists and engineers at L3Harris to introduce chip-level SWaP reductions to their systems. The group is available to help model and design microsystems and then develop the microfabrication processes needed to make the system a reality. It is also available to assist the photomask design and layout, multiphysics modeling or full system creation including water or chip microfabrication.
