SPIE Defense + Commercial Sensing

17 April 2025 • 10:40 AM - 11:00 AM EDT | Osceola Ballroom B, Ballroom Level | Part of SPIE Defense + Commercial Sensing

Advances in Cryo-Cooler Technology/Business Model at L3Harris

Mike Ratliff, Josh Millward, Andy Mondy, John Colston and Doug DaPaoli — Space & Sensors division of L3Harris Technologies, Mason, Ohio

L3Harris has vertically integrated cryo-cooler production for more than 15 years.  In that time the cryo-coolers products have been developed for thermal load capability between 200 – 5,000 mW to support internal and external customers.  The technology focus has been to addresses micro-miniaturization and large thermal load cryo-cooler packages while promoting high capability.  Recent inroads have been to promote high reliability and increase manufacturability as a domestic Cryo-cooler producer.  The next step is for L3Harris Space and Sensors to commercialize our cooler product line over the next 12-24 months, as we leverage our established high-rate production capabilities and the stabilized maturity of our product designs. We are investing in our infrastructure to support the consistent output of high-quality products, ensuring that we can meet market demands swiftly and efficiently. The design maturity of our offerings reflects our commitment to reliability and excellence, having undergone extensive verification and validation. 

15 April 2025 • 1:30 PM - 2:00 PM EDT | Osceola Ballroom B, Ballroom Level

L3Harris Advancements in Large Format Type II Superlattice FPA Technology

Robert A. Jones, Jon Blevins, Steve Allen, Dan Chmielewski, Rudy Fink — Space & Sensors division of L3Harris Technologies, Mason, Ohio

L3Harris continues to develop, improve and transition HOT MWIR Type II Superlattice (T2SL) technology into smaller pitch and larger formats for development and production programs. The T2SL material structure was initially developed through the tri-service Vital Infrared Sensor Technology Acceleration (VISTA) program which rapidly matured III-V semiconductor epitaxy to produce tactically viable detectors through C5ISR-RIT (formally NVESD) with funding from the Office of the Secretary of Defense (OSD) Defense-Wide Manufacturing and Science Technology (DMS&T). The T2SL material system provides the opportunity to generate tunable band gaps for creating lattice-matched heterojunction devices and are integral to suppressing sources of dark currents. The unique design of these heterojunction devices to reduce dark current mechanisms enables MWIR FPAs to operate at higher temperatures with increased system level reliability. The evolution of T2SL MWIR detectors at L3Harris in Mason, Ohio has resulted multiple breakthroughs for both technology and manufacturability.  These include but are not limited to increased QExFF, transition from 75mm to > 125mm T2SL wafer size, a simplified process that increases yield, and an overall reduction of dark currents at higher operating temperatures.  Advancements in the patented front-side illuminated Focal Plane Array (FPA) technology also make the industry leading ultra-large format FPA production and extended cryo-cycling lifetimes possible. To date, L3Harris in Mason, Ohio has delivered > 3,000 T2SL FPAs in various formats as completed IDCEA.   

L3Harris continues to develop, improve and transition HOT MWIR Type II Superlattice (T2SL) technology into smaller pitch and larger formats for development and production programs. The T2SL material system provides the opportunity to generate tunable band gaps for creating lattice-matched heterojunction devices and are integral to suppressing sources of dark currents. The unique design of these heterojunction devices to reduce dark current mechanisms enables MWIR FPAs to operate at higher temperatures with increased system level reliability. Technology advancements include but are not limited to increased QExFF, transition from 75mm to > 125mm T2SL wafer size, a simplified process that increases yield, and an overall reduction of dark currents at higher operating temperatures.