The three-day event, organized by the Florida Semiconductor Institute (FSI), took place at L3Harris’ High Technology Center in Palm Bay, Florida. FSI held the second-annual event to support efforts to advance the U.S. semiconductor and microelectronics industry.
“L3Harris is proud to partner with FSI and the University of Florida to positively shape the future of semiconductor technology,” said Dimitri Alves, General Manager, L3Harris Microelectronics. “Together, we are leading innovative microelectronics industry research and development while proactively working with policymakers on critical initiatives.”
L3Harris is a leader in advanced microelectronics – designing, building and verifying innovative technology in secure fabrication and analysis labs to provide custom solutions on an efficient and accelerated timeline.
“We have responded to the exploding demand for secure, next-generation microelectronics made in the United States as competition from China accelerates,” Alves said. “This technology is vital for U.S. national security because it is used in extremely important defense applications.”
During the event, L3Harris Senior Scientist Alan Huffman gave a presentation on how innovative engineering and manufacturing techniques are allowing more power in a smaller space in microelectronics, a concept called advanced packaging. The U.S. needs an advanced packaging ecosystem that keeps it ahead of competitors around the world.
L3Harris Microelectronics Chief Engineer Amy Bonecutter-Leonard shared her insight during a discussion of semiconductor workforce challenges, pointing out the need to train new generations of technicians while also upskilling current employees.
FSI is the statewide hub for research and development of semiconductor technologies as well as workforce initiatives to support those efforts. Its goal is to make Florida a global leader in specialty electronics by fostering the state’s semiconductor ecosystem and creating new, high-wage jobs. Alves serves on the FSI Stakeholder Advisory Board.
